ALD Beneq TFS 200
The Beneq TFS 200 Atomic Layer Deposition (ALD) system is designed for advanced thin film research purposes, with both thermal ALD capability, and plasma option for Plasma-Enhanced ALD (PEALD), in-situ etching, substrate pre-treatment and substrate post-treatment. Substrate alternatives include wafers and other planar substrates, complex 3D substrates as well as powders and other porous substrates.
- Water cooled cold-wall vacuum chamber
- Hot-wall reaction chamber inside the vacuum chamber
- Process temperature up to 500ºC
- Top or side substrate loading
- Up to 200 mm wafers
- Two liquid precursor lines
- Two hot precursor sources (up to 300ºC) for precursors with low vapor pressure or solid precursors
Sala blanca
La sala blanca de nanoGUNE, dedicada a la fabricación y caracterización de las propiedades de los materiales en la nanoescala, es un laboratorio de 300m2 donde la pureza del aire está bajo estricta supervisión.
Equipamiento
State-of-the-art equipment, including electron and scanning-tunneling microscopes, as well as other nanofabrication and characterization tools, are managed by specialists and used by researchers from a wide variety of fields.